Thin Wafer Market Size 2021 Global Industry Report, Statistics | Forecast To 2027

Thin Wafer Market Size 2021 Global Industry Report, Statistics | Forecast To 2027

The research report on thin wafer market, in substance, presents an exclusive understanding of the vast expanse of the business space in question. The report comprises a gist of the industry by means of providing an executive summary, industry insights, industry ecosystem analysis, market segmentation, and global trends. Furthermore, the study also provides deliverables pertaining to the regulatory and competitive landscapes and the strategic perspectives of various industry contenders with respect to the market.

The thin wafer market is anticipated to be driven by mounting demand for AI-chipsets in the automotive sector. AI chipsets when used in automotive applications can promote high-performance and energy efficiency. As electric vehicles are steadily replacing traditional IC engine vehicles worldwide given to concerns like spiking emission levels, the demand for automotive electronics to likely spur at a stellar rate in the coming years.

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The COVID-19 pandemic has severely impacted the thin wafer market growth. Due to strict lockdowns imposed by the government, the import and export of raw materials was severely hampered. As the major manufacturing industries were completely dependent on China for electronic hardware, businesses worldwide incurred heavy loss. For fixing this issue, companies are now investing in establishing their own production facilities which is expected to add impetus to the market in the coming years.

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The Europe thin wafer market is projected to register a CAGR of 6.5% from 2021 to 2027. The region composes of the presence of some of the major semiconductor manufacturers worldwide such as Siltronic AG, Nexperia, X-fab, Infineon Technologies AG, GlobalFoundries, and STMicroelectronics among others. Supportive government initiative along with rising investments could further develop new opportunities for wafer manufacturing in Europe. In December 2018, the European Commission along with the UK, France, Germany, and Italy announced a joint project for new R&D and innovation in the fields of microelectronics and semiconductors.

Organizations operating in the market include SK Siltron Co., Ltd., Shanghai Simgui Technology Co., SOITEC, Siltronic AG, Ltd., University Wafer, Inc., Global Wafers, SUMCO CORPORATION, Shin-Etsu Chemical Co., Ltd., and Silicon Valley Microelectronics, Inc., among others. Some of these companies are investing in R&D activities and launching novel products to stay competitive in the market. One example being GlobalWafers signing a Memorandum of Understanding (MOU) with GlobalFoundries to develop a long-term supply agreement for 300mm SOI (silicon-on-insulator) wafers in 2020.

Major Key Points from Table of Content:

Chapter 5   Thin Wafer Market, By Thickness

5.1    Key trends by thickness

5.2    >200 μm

5.2.1    Market estimates and forecasts, 2016 – 2027

5.3    100 μm-199 μm

5.3.1    Market estimates and forecasts, 2016 – 2027

5.4    50 μm-99 μm

5.4.1    Market estimates and forecasts, 2016 – 2027

5.5    30 μm-49 μm

5.5.1    Market estimates and forecasts, 2016 – 2027

5.6    10 μm-29 μm

5.6.1    Market estimates and forecasts, 2016 – 2027

5.7    <10 μm

5.7.1    Market estimates and forecasts, 2016 – 2027

Chapter 6   Thin Wafer Market, By Wafer Size

6.1    Key trends by wafer size

6.2    100 mm

6.2.1    Market estimates and forecasts, 2016 – 2027

6.3    125 mm

6.3.1    Market estimates and forecasts, 2016 – 2027

6.4    200 mm

6.4.1    Market estimates and forecasts, 2016 – 2027

6.5    300 mm

6.5.1    Market estimates and forecasts, 2016 – 2027

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