Semiconductor Manufacturing Equipment Market Global Trend, Segmentation and Opportunities Forecast to 2027

Semiconductor Manufacturing Equipment Market Global Trend, Segmentation and Opportunities Forecast to 2027

The semiconductor manufacturing equipment market analysis document represents a detailed collection of prioritized market definitions, industry scope and reach, and pivotal industry insights. Information about the many pitfalls of the market as well as the frequent challenges encountered by core industry players have been summarized in the report. That apart, the document also endorses details about the numerous driving parameters impacting the revenue landscape of this vertical.

The semiconductor manufacturing equipment market is set to undergo rapid transformation in the next several years. Chipmakers worldwide are witnessing demand for memory ICs such as SRAM, DRAM, and MRAM in gaming and entertainment applications. These chips are used in most gaming hardware in use today to improve graphics and deliver lag-free gaming experience. According to the nonprofit organization UKIE, the U.K. witnessed gaming console sales worth US$1,037 billion in 2020, a staggering 74.8% increase compared to the previous year.

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The application of polishing and grinding processes in the production of chipsets, MEMS sensors, ICs, and optics is expanding continuously. The need for miniaturization of electronics components regular polishing and grinding in order to minimize subsurface damage and maintain wafer flexibility. In 2020, polishing and grinding equipment held over 3% of the overall market share and its demand could rise at over 5% in the coming years.

In anticipation of this demand, chipmakers are rolling out new solutions in the market. for instance, AMC Research Inc. launched Ultra Stress-Free Polishing (SFP) tool in March last year. Designed for advanced semiconductor packaging and wafer processing, the tool helps chipmakers improve wafer processing and cut operational costs.

In terms of dimension, the 2D segment captured about 30% of the semiconductor manufacturing equipment market in 2020 and could expand at more than 6% CAGR in the future. 2D architecture offers numerous benefits including low-cost operation, lower power consumption, and a robust built. Various electronics companies and research institutes are collaborating to design 2D material-based ICs. In May, for example, TSMC had partnered with MIT and the National Institute of Taiwan (NTU) for the development of 1 nm chips.

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Europe semiconductor manufacturing equipment market size is slated to expand at over 4.5% CAGR up to 2027. The regional market is driven by government investments and initiatives to accelerate local chip production. in March this year, for instance, the European Union announced plans to boost chip production capacity by 20% by the year 2030. As part of this commitment, EU invested USD 160 billion in semiconductor production and supply chain infrastructure. The region is also witnessing collaborations among various chipmakers. Citing an example, in April last year, STMicroelectronics collaborated with Huawei to develop fabricated chips for the automotive sector.

Some of the notable companies in the semiconductor manufacturing equipment market include Applied Materials Inc., Nordson Corporation, ASML Holdings N.V., Veeco Instruments Inc., Micron Technology Inc., and Intel Corporation to name a few.

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